Prime Minister Narendra Modi will inaugurate Micron Semiconductor Technology India’s Assembly, Test and Packaging (ATMP) facility in Sanand, Gujarat, on February 28, marking the start of commercial production and shipment of India-made semiconductor memory modules.
The Sanand facility represents a major milestone in India’s semiconductor manufacturing roadmap, enabling domestic assembly and packaging of memory chips and integrating the country more deeply into the global semiconductor value chain.
The plant will process advanced Dynamic Random Access Memory (DRAM) and NAND wafers sourced from Micron’s global manufacturing network into finished memory and storage products for worldwide markets.
The project, with a total outlay exceeding ₹22,500 crore, was the first semiconductor proposal approved under the India Semiconductor Mission and broke ground in September 2023.
Construction progressed rapidly following approval, reflecting the government’s push to establish semiconductor manufacturing capacity in India.
Once fully ramped up, the Sanand ATMP facility will include approximately 500,000 square feet of cleanroom space, making it one of the largest raised-floor cleanrooms globally.
The facility is designed to meet growing global demand for memory and storage products driven by artificial intelligence, data centres, and high-performance computing.
The operationalisation of Micron’s Sanand plant is expected to mark India’s entry into commercial semiconductor memory module production and strengthen the country’s ambition to become a competitive destination for semiconductor manufacturing and advanced electronics supply chains.
